Transfer technology of high-performance electronic devices made with single crystalline thin film semiconductors (or highperformance thin films synthesized under high temperature process) on flexible substrates for continuously mass-producing flexible electronic devices of high-performance

 

Client / Market

• Inorganic micro-LED display with high-performance, flexible compound semiconductor solar cell, flexible thin film battery, wearable and implantable devices and sensors for human body

 

Necessity of this Technology

• Development of a flexible electronic device technology with high performance and great flexibility
• The performance of flexible electronic devices made with organic matters is very low, and electronic devices made with the semiconductor technology has high performance but low flexibility. There is a need for a manufacturing technology for a flexible device with high performance.
• Development of a rollable tablet PC or high-performance display demands a production technology that can satisfy high performance and flexibility requirements.

 

Technical Differentiation

• It is possible to realize and commercialize flexible electronics devices with highperformance using the well-established silicon semiconductor technology. This is also beneficial to securing yield and reliability of the flexible electronic devices.
• High performance thin film material synthesized under a high temperature can be integrated with a flexible polymeric film.
• It is possible to realize a flexible device with the best performance by transferring an electronic device with the today’s best specifications on a flexible film.
• The difference of this technology compared to competing technologies (organic matter-based printing technology) is that it enables flexible electronic device realization using single crystalline silicon, oxide semiconductor, and III-V compound semiconductor that have outstanding properties compared to any organic semiconductors.
• This technology has higher stability regarding humidity and temperature and higher durability than organic device technology.
• An improvement is made to overcome the limitations of the flat stamp technologies by transferring semiconductor thin film on the flexible substrate using a roll-stamp.

 

Excellence of Technology

• A high-performance semiconductor device is fabricated in a thin film form on a substrate wafer. The device is lifted off from the substrate wafer, then transferred onto a flexible substrate using a roll stamp. This electronic device boasts great flexibility, and high stretchability depending on the design method.
• Covered by 13 media including Digital Times and SBS on December 27, 2012.

 

Current Intellectual Property Right Status

PATENT

• Hierarchical Structure and Method for Manufacturing the Same (KR1022016, US8551353, CN200980129153.3, JP5575766)
• Manufacturing Apparatus for Hierarchical Structure (KR1022017, pct/kr2009/005527, US13/122.240, CN201310399672.X)
• Stamp for Large Area Transfer and Transfer System Using the Same Stamp (KR0969998)
• Active Removable Chuck (KR0998087, KR1027752, KR1045102)
• Apparatus for Synchronization between Roll Stamp and Translation Stage(KR1227180)
• Flexible Devices with Inorganic Solid Layers and Method for Manufacturing the Same (KR1093133)